At the forefront of the intersection of semiconductor material science and power electronics technology, Faster Semiconductor and HANA Group have once again joined forces, deepening their technical collaboration to

 jointly advance the research and innovation of silicon carbide (SiC) power modules. The fruits of this collaboration are remarkable. Faster Semiconductor's latest P2B SiC power module, specifically designed for critical 

areas such as new energy vehicle charging stations, photovoltaic energy systems, energy storage devices, motor drive systems, and uninterruptible power supplies (UPS), not only showcases Semiconductor's profound

expertise and exceptional innovation capabilities in SiC applications but also meets the urgent market demands with high efficiency, high reliability, and compact design. Furthermore, the two parties have planned to launch

4 new SiC power modules within the year, further enriching the product line to address a broader range of market needs with more comprehensive solutions, jointly leading the power electronics industry to new heights. 

Building an efficient vertical supply chain, leading SiC technology innovation.

The Faster module series relies on its complete vertical supply chain system, achieving full-process autonomy and control from materials and wafer manufacturing to design production, packaging, and rigorous quality testing. 

The wafers used in this series come from the cooperative investor, Power Master Semiconductor, whose advanced eSiC MOSFET technology brings significant system efficiency improvements and power density enhancements 

to the Faster modules, offering great design flexibility. Importantly, the SiC MOSFET's extremely low switching loss and the absence of body diode reverse recovery ensure the module's high reliability. These advantages make 

the Faster modules exhibit strong market competitiveness in cost control and product quality, setting an industry benchmark. Diversified packaging technology meets diverse application needs.

Faster Semiconductor's SiC power modules cover a variety of advanced packaging types, including 34mm, P2B, Econo2, and HP1, aiming to comprehensively meet the diverse needs of different application scenarios.

By utilizing advanced packaging technology and silicon carbide semiconductor materials, a high power output is achieved within a 34mm size range, capable of meeting the demands of high-power applications while reducing the module's volume and weight. Equipped with the latest generation of SiC MOSFET chips, which feature extremely low switching and conduction losses, it can minimize the size of cooling components, reduce the system's energy loss, and improve energy utilization efficiency. This is beneficial for reducing the system's volume and weight, while also enhancing the system's response speed. Moreover, multiple modules can be conveniently used in parallel to meet the needs of even higher power applications.

The flexible PIN layout design of the P2B module package ensures that both the driving loop and the power loop are optimized, which is particularly crucial for high-speed switching devices like SiC. Additionally, the adoption of advanced planar grid structures, direct copper bonding (DCB) technology, and efficient heat sink designs enables the module to maintain stable performance even under high temperature and high load conditions. This makes it especially suitable for applications in industrial motor drives and electric vehicle charging facilities.

The HP1 is specifically designed for high power density applications, utilizing ceramic packaging and multi-layer wiring technology to achieve high power density integration. Moreover, the application of liquid cooling technology and micro-channel heat dissipation structures ensures that the module maintains a stable temperature even during high-power operation, making it particularly suitable for fields such as rail transit and high-voltage direct current transmission.

Leveraging its profound expertise and innovative capabilities in the SiC power module sector, Faster has successfully launched a series of high-performance SiC power modules, offering novel solutions for new energy power generation, industrial applications, and the transportation sector. These modules not only meet the market's urgent demand for high efficiency, high reliability, and compact design but also drive the continuous advancement and development of power electronics technology. In the future, FasterSemi will continue to delve deeper into the SiC power module field, committed to promoting technological innovation and industrial upgrading, and bringing more high-performance, cost-effective products to the market

Contact Information:

Shanghai Sales Center:  

Tel: +86 13148111158  

Room 1407, No. 317 Xianxia Road, Changning District, Shanghai  

Shenzhen Sales Center:

Tel: +86 18025369656  

No. 4018 Jintian Road, Futian District, Shenzhen