NEWS
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2025.06FASTER Press Release Unveils Innovative Top-Side Cooling Packages for automotive and industrial applications
New Product Release InformationFaster Semiconductor has announced the expansion of itseSiC MOSFET family with introduction of new AEC-Q101 qualified, high-performance top-side cooling packages. These include the TSPAK DBC version and LF version, specially designed for automotive and indu [查看更多 ...]14
2025.0330-Day Countdown! Faster Invites You to Attend Electronica Shanghai!
Dear Customers, Partners, and Industry Colleagues,Greetings!Faster Semiconductor cordially invites you to visit our booth atElectronica Shanghai, held fromApril 15th to 18th, 2025, at theShanghai New International Expo Center. Our booth is located atN4.621, and we look forwar [查看更多 ...]13
2025.03Faster & HANA Powerful Collaboration to Jointly Develop SiC Power Modules
At the forefront of the intersection of semiconductor material science and power electronics technology, Faster Semiconductor and HANA Group have once again joined forces,deepening their technical collaboration to jointly advance the research and innovation of silicon carbide (SiC) power modules. Th [查看更多 ...]27
2024.11The cooperation of Chinese, Thai and South Korean enterprises to create a new SiC brand and jointly focus on the Chinese EV market！
Recently, Shanghai Favorit and South Korea's PMS (PowerMaster Semiconductor) announced the joint venture brand Faster Semiconductor (Faster Semiconductor) to launch advanced silicon carbide (SiC) semiconductor solutions for the Chinese automotive market. At the same time, Shanghai Figuret has al [查看更多 ...]
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